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SDC15
PROTECTION PRODUCTS
Applications Information
Device Connection for Protection of One Data Line
The SDC15 is designed to protect one data or I/O line
operating at ±12 volts. Connection options are as
follows:
Common mode protection: Pin 1 is connected to
the data line and pin 2 is connected to ground. For
best results, this pin should be connected directly
to a ground plane on the board. The path length
should be kept as short as possible to minimize
parasitic inductance. Pin 3 is not connected.
Differential protection: Pin 1 is connected to one
line and pin 2 is connected to the second line. Pin
3 is not connected.
Circuit Board Layout Recommendations for Suppres-
sion of ESD.
Good circuit board layout is critical for the suppression
of fast rise-time transients such as ESD. The following
guidelines are recommended:
Place the SDC15 near the input terminals or
connectors to restrict transient coupling.
Minimize the path length between the SDC15 and
the protected line.
Minimize all conductive loops including power and
ground loops.
The ESD transient return path to ground should be
kept as short as possible.
Never run critical signals near board edges.
Use ground planes whenever possible.
Matte Tin Lead Finish
Matte tin has become the industry standard lead-free
replacement for SnPb lead finishes. A matte tin finish
is composed of 100% tin solder with large grains.
Since the solder volume on the leads is small com-
pared to the solder paste volume that is placed on the
land pattern of the PCB, the reflow profile will be
determined by the requirements of the solder paste.
Therefore, these devices are compatible with both
lead-free and SnPb assembly techniques. In addition,
unlike other lead-free compositions, matte tin does not
have any added alloys that can cause degradation of
the solder joint.
Device Schematic and Pin Configuration
RS-232 Transceiver Protection Example
? 2004 Semtech Corp.
4
www.semtech.com
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